TINTRONICS | Veteran Owned and Operated

ServicesHot Solder Dip BGA Reball and Repair Tape & Reel Packaging Precision Lead FormingPortfoliosHot Solder Dip of a
QFN Chip PCB Connect Point in
SMT Carrier J-Lead Forming of a
MOSFET Transistor Wire Strip/Trim and
Lead-free Solder Dip of
RFI Filter

Leading the Way Since 1988,Technology, Innovation, Service & Value

Hot Solder Dip

BGA Reball and Repair

BGA Reball and Repair

Tape & Reel Packaging

Tape & Reel Packaging

Precision Lead Forming

Precision Lead Forming

View Examples of our Portfolios >>

DFN Tinning

Through Hole in SMT Tape

Through Hole
in SMT Tape

Through Hole to J-Lead Form

Through Hole
to J-Lead Form

Wire Trim and HSD No-Lead Solder

Wire Trim and HSD
No-Lead Solder

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